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About
Rooted in Research.
Powering Performance.
From IISc labs to real-world GaN solutions—where deep science meets practical impact.
Why We Exist
We’re on a mission to unlock GaN’s full promise by delivering turnkey platforms that accelerate innovation and reliability.
Democratize GaN: materials, devices & systems in one place
Democratize GaN: materials, devices & systems in one place
End-to-end expertise: from wafers to RF modules
End-to-end expertise: from wafers to RF modules
Built for scale: robust performance in telecom, automotive, defence
Built for scale: robust performance in telecom, automotive, defence
Backed by science: rigorous R&D, hands-on engineering
Backed by science: rigorous R&D, hands-on engineering
Built on Science.
Driven by Impact.
We’re a cross-disciplinary team of scientists, engineers, and tech enthusiasts working hands-on to deliver application-ready GaN solutions. At AGNIT, deep-tech meets agility, and collaboration fuels everything we do.
20+
Patents
20+
Patents
in GaN materials &
devices
in GaN materials & devices
18+
Years
18+
Years
of GaN R&D
excellence
of GaN R&D excellence
1
Vision
1
Vision
of production-ready
GaN wafers
of production-ready GaN wafers
Our Journey
2021
AGNIT begins operations as a spin-off from IISc and raises $1.3M in angel funding to kickstart GaN technology development.
2022
2021
2023
2024





Hands-on scientists, engineers & reliability experts.

Hands-on scientists, engineers & reliability experts.
Power up with GaN
Power up with GaN
2025 ©AGNIT Semiconductors Pvt. Ltd.
All rights reserved.
Power up with GaN
2025 ©AGNIT Semiconductors Pvt. Ltd.
All rights reserved.
Our Journey
Our Journey
2021
Agnit begins operations as a spin-off from IISc and raises $1.3M in angel funding to kickstart GaN technology development.
2022
Marks the sale of our first wafers and the development of initial RF prototypes.
2023
Launch of our first commercial RF devices and recipient of the prestigious iDEX grant.
2024
Expansion to 5 wafer SKUs, first international exports, and pilot deployments of RF devices for strategic applications. Raised $3.5M from 3one4 Capital and Zephyr Peacock to scale product offerings.
Democratize GaN: materials, devices & systems in one place
End-to-end expertise: from wafers to RF modules
Built for scale: robust performance in telecom, automotive, defence
Backed by science: rigorous R&D, hands-on engineering
Democratize GaN: materials, devices & systems in one place
End-to-end expertise: from wafers to RF modules
Built for scale: robust performance in telecom, automotive, defence
Backed by science: rigorous R&D, hands-on engineering
Democratize GaN: materials, devices & systems in one place
End-to-end expertise: from wafers to RF modules
Built for scale: robust performance in telecom, automotive, defence
Backed by science: rigorous R&D, hands-on engineering
Democratize GaN: materials, devices & systems in one place
End-to-end expertise: from wafers to RF modules
Built for scale: robust performance in telecom, automotive, defence
Backed by science: rigorous R&D, hands-on engineering